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Effect of water-soluble chitosan content and target density on the properties of corn husk particleboard

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Kurnia Wiji Prasetiyo1,2*, Dede Hermawan1*, Yusuf Sudo Hadi1, Subyakto2 Deni Zulfiana3, Ignasia Maria Sulastiningsih2 and Titik Kartika4
» doi: 10.48047/ecb/2023.12.12.09


Particleboards are wood-based composite panel products produced from lignocellulosic materials, which can be combined with adhesive and hot-pressed into sheets for various purposes. However, the most common adhesive is based on formaldehyde and has been reported to be detrimental to health and the environment. This indicates that there is a need to develop environmentally friendly alternative adhesive with low toxic effects. Therefore, this study aims to evaluate the feasibility of water-soluble chitosan (WSC) as an adhesive in particleboard fabricate based on corn husk as well as to determine the influence of its content and target density variations on the properties of particleboard. The target density of board was varied at 0.6, 0.8 and 1.0 g/cm3. The variation of WSC content used was 6, 8 and 10% based on the air-dried particles weight. The manufacture of particleboard was made under a press temperature of 180o C for 15 minutes under 2.5 MPa press pressure. The results showed that WSC is proven as a natural adhesive for particleboard. The properties of particleboard were shown to be affected by the adhesive content and variation of target density. Particleboard with 8% of WSC content and target density of 0.8 g/cm3 were resulted best properties compared other compositions, relatively.

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